US Patent No. 10,602,610

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE WITH THE SAME


Patent No. 10,602,610
Issue Date March 24, 2020
Title Printed Circuit Board And Electronic Device With The Same
Inventorship Man Ho Kim, Suwon-si (KR)
Hwa Joong Jung, Osan-si (KR)
Tae Yun Kim, Suwon-si (KR)
Yong Hwan Choi, Suwon-si (KR)
Ki Huk Lee, Suwon-si (KR)
Assignee Samsung Electronics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 10,602,610

1. A printed circuit board comprising:a first pattern configured to be formed in a first layer, wherein the first layer is a ground layer or a power layer;
a second pattern formed in a second layer under the first layer, wherein the second layer is a signal layer;
a first signal pad disposed on an outer layer of the printed circuit board;
a second signal pad disposed on the outer layer of the printed circuit board;
a first signal via configured to electrically connect the first signal pad to the second pattern;
a second signal via configured to electrically connect the second signal pad to the second pattern;
a third via configured to electrically connect the first pattern to the second pattern, wherein the third via connects the ground layer or the power layer to the signal layer; and
a recess formed by removing at least a portion of an area where the third via is formed and configured to electrically separate the first pattern from the second pattern, wherein the ground layer or the power layer is electrically separate from the signal layer, and wherein the first signal pad and the second signal pad remain electrically connected through the signal layer after the recess is formed.