US Patent No. 10,602,608

CIRCUIT BOARD


Patent No. 10,602,608
Issue Date March 24, 2020
Title Circuit Board
Inventorship Yuichi Sugiyama, Tokyo (JP)
Masashi Miyazaki, Tokyo (JP)
Yutaka Hata, Tokyo (JP)
Assignee TAIYO YUDEN CO., LTD., Tokyo (JP)

Claim of US Patent No. 10,602,608

1. A circuit board, comprising:a flexible wiring board having a plurality of layers laminated therein, including wiring layers and insulating layers, the wiring board having three sections arranged in a lengthwise direction of the wiring board: a first section in one end, a second section in a middle, and a third section in another end, the first section having a cavity or cutout in a plan view,
a metal reinforcing member embedded in the cavity or cutout of the wiring board in the first section;
a first resin layer that is formed on a bottom surface of the wiring board in the first section and that is selectively formed on a bottom of the reinforcement member, the first resin layer being absent on the wiring board in the second and third sections;
a second resin layer that is formed on a top surface of the wiring board in the first section and that selectively covers a top surface the reinforcement member, the second resin layer being absent on the wiring board in the second and third sections;
a first wiring layer that is provided on the first resin layer and that is electrically connected to the wiring board in the first section; and
a second wiring layer that is provided on the second resin layer and that is electrically connected to the wiring board in the first section,
wherein the metal reinforcing member has one of a plate shape and a frame shape in the plan view, and
wherein the first section of the wiring board is positioned closer to the first wiring layer than to the second wiring layer in the vertical direction.