US Patent No. 10,602,605

TAMPER-RESPONDENT ASSEMBLIES WITH BOND PROTECTION


Patent No. 10,602,605
Issue Date March 24, 2020
Title Tamper-respondent Assemblies With Bond Protection
Inventorship William L. Brodsky, Binghamton, NY (US)
James A. Busby, New Paltz, NY (US)
Zachary T. Dreiss, Beacon, NY (US)
Michael J. Fisher, Poughkeepsie, NY (US)
David C. Long, Wappingers Falls, NY (US)
William Santiago-Fernandez, Poughkeepsie, NY (US)
Thomas Weiss, Poughkeepsie, NY (US)
Assignee INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)

Claim of US Patent No. 10,602,605

1. A method of fabricating a tamper-respondent assembly, the method comprising:providing at least one tamper-respondent sensor, the at least one tamper-respondent sensor comprising one or more tamper-detect networks defined, at least in part, by unexposed circuit lines within the at least one tamper-respondent sensor, and the at least one tamper-respondent sensor including at least one external bond region disposed over, in part, the unexposed circuit lines;
providing at least one conductive trace forming, at least in part, at least one tamper-detect network of the one or more tamper-detect networks, the at least one conductive trace being exposed, at least in part, on the at least one tamper-respondent sensor within the at least one external bond region, including over, in part, the unexposed circuit lines of the tamper-respondent sensor; and
providing an adhesive contacting the at least one conductive trace within the at least one external bond region of the at least one tamper-respondent sensor, the adhesive facilitating securing the at least one tamper-respondent sensor within the tamper-respondent assembly.