US Patent No. 10,602,604

ELECTRONIC COMPONENT UNIT


Patent No. 10,602,604
Issue Date March 24, 2020
Title Electronic Component Unit
Inventorship Naotaka Iwamoto, Yamanashi (JP)
Assignee FANUC CORPORATION, Yamanashi (JP)

Claim of US Patent No. 10,602,604

1. An electronic component unit comprising: a plurality of first electronic components which do not need to be cooled by a cooling plate; a plurality of second electronic components which are cooled by the cooling plate; a first circuit board in which at least one first electronic component of the plurality of first electronic components is mounted on a first surface and in which at least one second electronic component of the plurality of second electronic components is mounted on a second surface on a side opposite to the first surface; a second circuit board in which at least one first electronic component of the plurality of first electronic components is mounted on a first surface and in which at least one second electronic component of the plurality of second electronic components is mounted on a second surface on a side opposite to the first surface; the cooling plate which includes a first cooling surface and a second cooling surface located on a side opposite to the first cooling surface; and a cooling plate support unit which supports at least one portion of the cooling plate, the cooling plate support unit including a substantially concave holding portion that directly supports the cooling plate without any other supports, and a base portion that supports the holding portion, wherein the at least one second electronic component of the plurality of second electronic components mounted on the second surface of the first circuit board is cooled by contact with the first cooling surface of the cooling plate, and the at least one second electronic component of the plurality of second electronic components mounted on the second surface of the second circuit board is cooled by contact with the second cooling surface of the cooling plate.