US Patent No. 10,602,603

MOBILE TERMINAL AND HEAT DISSIPATION AND SHIELDING STRUCTURE


Patent No. 10,602,603
Issue Date March 24, 2020
Title Mobile Terminal And Heat Dissipation And Shielding Structure
Inventorship Zhiguo Zhang, Wuhan (CN)
Yingchun Zhang, Shenzhen (CN)
Haitao Zhen, Wuhan (CN)
Nanbo Kang, Shenzhen (CN)
Assignee HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)

Claim of US Patent No. 10,602,603

1. A mobile terminal, comprising:a rear housing;
a heat dissipation board comprising an accommodating space and a first surface, wherein the accommodating space comprises a through-hole structure;
a circuit board disposed on one side of the heat dissipation board and accommodated in the rear housing;
a screen disposed on another side of the heat dissipation board;
a heat emitting element disposed on the circuit board, wherein the heat emitting element is accommodated in a shielding space;
a shielding can comprising a top part and a bottom part that are disposed opposite to each other, wherein the shielding can is coupled to the circuit board and forms the shielding space together with the circuit board, wherein the bottom part of the shielding can is configured to be coupled to the circuit board, and wherein the top part of the shielding can is located above the heat emitting element and extends into the accommodating space of the heat dissipation board; and
a highly thermal-conductive body comprising a first area and a second area, wherein the first area is in contact with a top surface of the top part, and wherein the second area is in contact with the first surface of the heat dissipation board.