US Patent No. 10,561,025


Patent No. 10,561,025
Issue Date February 11, 2020
Title Method Of Manufacturing Polymer Printed Circuit Board
Inventorship Kuo-Hsin Chang, Chiayi County (TW)
Jia-Cing Chen, Tainan (TW)
We-Jei Ke, Hsinchu County (TW)
Jingyu Zhang, Hweian County (CN)
Chung-Ping Lai, Zhubei (TW)
Assignee BGT MATERIALS LIMITED, Manchester (GB)

Claim of US Patent No. 10,561,025

1. A method of manufacturing a polymer printed circuit board comprising in a sequential order steps of:A. providing a material layer consisting of a polymer film;
B. forming circuit pattern on the material layer, wherein the circuit pattern is comprised of laser induced graphene (LIG), and the laser induced graphene is porous;
C. depositing metal nanoparticles on the LIG of the circuit pattern so that the metal nanoparticles on the LIG of the circuit pattern is used as a metal seed of a meta layer formed on the LIG of the circuit pattern;
D. pressing the circuit pattern on which the metal nanoparticles are deposited; and
E. forming the metal layer on the LIG of the circuit pattern by using the metal seed, thus producing the polymer printed circuit board.