1. An electronic device comprising:a substrate having opposing first and second major surfaces and comprising liquid crystal polymer (LCP);
a plurality of electrically conductive vias through the substrate;
at least one circuit layer comprising a plurality of solder pads carried by the first major surface of the substrate and coupled to respective ones of the plurality of electrically conductive vias;
a plurality of LCP solder masks each carried by a respective one of the first and second major surfaces of the substrate, each LCP solder mask having a plurality of mask openings extending between first and second major surfaces thereof; and
at least one thin film resistor carried by at least one of the plurality of LCP solder masks and coupled between a corresponding pair of adjacent electrically conductive vias from among the plurality of electrically conductive vias;
each LCP solder mask being directly coupled to the substrate without an adhesive layer with the plurality of solder pads being aligned with the plurality of mask openings.