US Patent No. 10,561,023

METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A THIN FILM RESISTOR FORMED ON AN LCP SOLDER MASK AND RELATED DEVICES


Patent No. 10,561,023
Issue Date February 11, 2020
Title Method Of Making An Electronic Device Having A Thin Film Resistor Formed On An Lcp Solder Mask And Related Devices
Inventorship Louis Joseph Rendek, Jr., Melbourne, FL (US)
Assignee HARRIS CORPORATION, Melbourne, FL (US)

Claim of US Patent No. 10,561,023

1. An electronic device comprising:a substrate having opposing first and second major surfaces and comprising liquid crystal polymer (LCP);
a plurality of electrically conductive vias through the substrate;
at least one circuit layer comprising a plurality of solder pads carried by the first major surface of the substrate and coupled to respective ones of the plurality of electrically conductive vias;
a plurality of LCP solder masks each carried by a respective one of the first and second major surfaces of the substrate, each LCP solder mask having a plurality of mask openings extending between first and second major surfaces thereof; and
at least one thin film resistor carried by at least one of the plurality of LCP solder masks and coupled between a corresponding pair of adjacent electrically conductive vias from among the plurality of electrically conductive vias;
each LCP solder mask being directly coupled to the substrate without an adhesive layer with the plurality of solder pads being aligned with the plurality of mask openings.