1. A power semiconductor module comprising:a housing which houses a power semiconductor chip;
a plurality of control pins which protrude outward from an upper surface of the housing, and establish a direct electrical connection between the power semiconductor chip and a control board, at least one of the plurality of control pins being electrically connected to a driver IC to transfer a supply voltage to the driver IC or a control signal to control operation of the power semiconductor chip; and
at least one guide pin which protrudes outward from the upper surface of the housing, wherein
each of the plurality of control pins has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing, the at least one step contacting a back surface of the control board, and
a maximum diameter of each of the plurality of control pins is smaller than a maximum diameter of the at least one guide pin.