US Patent No. 10,561,019

ECOLOGICAL MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE


Patent No. 10,561,019
Issue Date February 11, 2020
Title Ecological Multilayer Structure For Hosting Electronics And Related Method Of Manufacture
Inventorship Tero Heikkinen, Oulunsalo (FI)
Antti Keranen, Oulunsalo (FI)
Mikko Heikkinen, Oulunsalo (FI)
Jarmo Saaski, Oulunsalo (FI)
Assignee TACTOTEK OY, Oulunsalo (FI)

Claim of US Patent No. 10,561,019

1. An integrated multilayer structure for hosting electronics, comprising:a 3d-formable first substrate comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side,
a plastic layer, comprising thermoplastic, molded onto said second side of the first substrate so as to at least partially cover it, and
a light source provided on the second side of the first substrate, said light source being at least partially embedded in the molded material of the plastic layer.