US Patent No. 10,561,016

FLEXIBLE CIRCUIT BOARD, COF MODULE AND ELECTRONIC DEVICE COMPRISING THE SAME


Patent No. 10,561,016
Issue Date February 11, 2020
Title Flexible Circuit Board, Cof Module And Electronic Device Comprising The Same
Inventorship Jun Young Lim, Seoul (KR)
Woong Sik Kim, Seoul (KR)
Hyung Kyu Yoon, Seoul (KR)
Min Hwan Kim, Seoul (KR)
Assignee LG INNOTEK CO., LTD., Seoul (KR)

Claim of US Patent No. 10,561,016

1. A flexible circuit board comprising:a substrate;
a first wiring pattern layer provided on a first surface of the substrate;
a first plating layer provided on the first wiring pattern layer and including a first open area;
a second plating layer provided on the first plating layer and including a second open area;
a first protective layer that directly contacts one surface of the first wiring pattern layer exposed at the first open area, a side surface of the first plating layer, and a side surface of the second plating layer;
a second wiring pattern layer provided under a second surface opposite to the first surface of the substrate;
a third plating layer provided under the second wiring pattern layer;
a fourth plating layer provided under the third plating layer; and
a second protective layer provided under the fourth plating layer,
wherein the first protective layer is provided higher than an upper surface of the second plating layer,
wherein a width of the second open area of the second plating layer is larger than a width of the first open area of the first plating layer, and
wherein an upper surface of the first plating layer exposed in the second open area is in direct contact with the first protective layer.