US Patent No. 10,561,015

FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY AND METHOD FOR PREPARING SAME


Patent No. 10,561,015
Issue Date February 11, 2020
Title Flexible Circuit Board Having Enhanced Bending Durability And Method For Preparing Same
Inventorship Sang Pil Kim, Hwaseong-si (KR)
Da Yeon Lee, Hwaseong-si (KR)
Hwang Sub Koo, Hwaseong-si (KR)
Hyun Je Kim, Hwaseong-si (KR)
Hee Seok Jung, Hwaseong-si (KR)
Assignee GigaLane Co., Ltd., Hwaseong-si, Gyeonggi-do (KR)

Claim of US Patent No. 10,561,015

1. A method of manufacturing flexible circuit board having enhanced bending durability, the method comprising:(a) forming a signal line and a first ground layer on a first dielectric, and forming a second ground layer on the bottom surface of the first dielectric;
(b) preparing a second dielectric;
(c) preparing a first bonding sheet and a first protective sheet connected to one end of the first bonding sheet or positioned to overlap at least a part thereof;
(d) bonding the second dielectric on the first dielectric via the first bonding sheet;
(e) forming a via hole so that the first ground layer and the second ground layer are connected electrically; and
(f) cutting the second dielectric on the first protective sheet in the width direction.