US Patent No. 10,561,013

COUPLED VIA STRUCTURE, CIRCUIT BOARD HAVING THE COUPLED VIA STRUCTURE


Patent No. 10,561,013
Issue Date February 11, 2020
Title Coupled Via Structure, Circuit Board Having The Coupled Via Structure
Inventorship Dong-Yoon Seo, Seoul (KR)
Jea-Eun Lee, Seoul (KR)
Wansoo Nah, Suwon-si (KR)
Assignee Samsung Electronics Co., Ltd., Gyeonggi-do (KR)

Claim of US Patent No. 10,561,013

1. A coupled via structure comprising:a plate via penetrating through a board body, the plate via including a first plate and a second plate, the first plate and the second plate facing each other with a first gap distance therebetween;
a contact pad connected to the plate via on a surface of the board body, the contact pad including a first contact connected to the first plate and a second contact connected to the second plate, the first contact and the second contact being separated from each other; and
a connection line connected to the contact pad on the surface of the board body, the connection line including a first line and a second line, the first line connected to the first contact and the second line connected to the second contact, the second line being spaced apart from the first line by a second gap distance such that the connection line is connected to a coupled signal line having a main signal line for transferring a main signal and a complementary signal line for transferring a complementary signal with respect to the main signal,
wherein the contact pad is in a shape of a plate having a width and a thickness such that the width of the contact pad substantially equals a width of the plate via and a thickness of the contact pad substantially equals a thickness of the plate via.