US Patent No. 10,561,012

METHODS RELATED TO IMPLEMENTING SURFACE MOUNT DEVICES WITH GROUND PATHS


Patent No. 10,561,012
Issue Date February 11, 2020
Title Methods Related To Implementing Surface Mount Devices With Ground Paths
Inventorship Howard E. Chen, Anaheim, CA (US)
Assignee Skyworks Solutions, Inc., Woburn, MA (US)

Claim of US Patent No. 10,561,012

1. A method for fabricating a radio-frequency module, the method comprising:providing a packaging substrate, the packaging substrate configured to receive a plurality of components, the packaging substrate including a ground plane;
mounting a surface mount device on the packaging substrate;
forming an overmold over the packaging substrate, the overmold encapsulating the surface mount device;
forming an opening defined in the overmold at a region over the surface mount device, the opening having sufficient depth to expose a region of the surface mount device; and
forming or providing a conductive layer over the surface mount device such that the surface mount device electrically connects the conductive layer with the ground plane to thereby provide radio-frequency shielding between first and second regions about the surface mount device, the first and second regions being within the radio-frequency module.