1. A method for fabricating a radio-frequency module, the method comprising:providing a packaging substrate, the packaging substrate configured to receive a plurality of components, the packaging substrate including a ground plane;
mounting a surface mount device on the packaging substrate;
forming an overmold over the packaging substrate, the overmold encapsulating the surface mount device;
forming an opening defined in the overmold at a region over the surface mount device, the opening having sufficient depth to expose a region of the surface mount device; and
forming or providing a conductive layer over the surface mount device such that the surface mount device electrically connects the conductive layer with the ground plane to thereby provide radio-frequency shielding between first and second regions about the surface mount device, the first and second regions being within the radio-frequency module.