US Patent No. 10,512,199

POWER CONVERSION APPARATUS PROVIDED WITH SEMICONDUCTOR MODULE AND ELECTRONIC COMPONENT PRESSURIZED BY PRESSURIZING MEMBER


Patent No. 10,512,199
Issue Date December 17, 2019
Title Power Conversion Apparatus Provided With Semiconductor Module And Electronic Component Pressurized By Pressurizing Member
Inventorship Naoki Hirasawa, Nihio (JP)
Ryota Tanabe, Kariya (JP)
Takashi Kawashima, Kariya (JP)
Takashi Yanbe, Sendai (JP)
Masahiro Kondou, Sendai (JP)
Assignee DENSO CORPORATION, Kariya (JP) TOKIN CORPORATION, Sendai (JP)

Claim of US Patent No. 10,512,199

1. A power conversion apparatus comprising:a semiconductor module that integrates a semiconductor element;
an electronic component electrically connected to the semiconductor module;
a plurality of cooling pipes that cool the semiconductor module and the electronic component, the cooling pipes being disposed to sandwich both sides of the semiconductor module and the electronic component;
a casing that accommodates the semiconductor module, the electronic component and the cooling pipes, an abutting surface being provided at a part of the casing, wherein the electronic component comes into contact with the abutting surface;
a semiconductor section including the semiconductor module and the cooling pipes arranged therein;
an electronic component section including the electronic component and the cooling pipes; and
a pressurizing member that pressurizes the semiconductor section in a first direction, the first direction extending from the semiconductor module to the electronic component section, wherein
the semiconductor section and the electronic component section are arranged to be adjacent to each other;
the electronic component includes a part body and a wing portion; and
the wing portion protrudes from the part body at either one side or both sides thereof with respect to a second direction as a horizontal direction which is perpendicular to the first direction, and the wing portion has a surface facing the abutting surface in the first direction, and the surface of the wing portion and the abutting surface are in contact with each other, wherein
the casing includes a bottom plate portion and a peripheral wall portion;
the bottom plate portion faces, from a bottom side which is one side in a third direction, the semiconductor module, the electronic component and the cooling pipes;
the peripheral wall portion stands from a periphery edge of the bottom plate portion towards an upper part which is the other side with respect to the third direction;
the abutting surface is formed on a protrusion protruding from the bottom plate portion towards an upper part with respect to the third direction; and
the wing portion is disposed between the bottom plate portion and the connection pipe in the electronic component section with respect to the third direction.