US Patent No. 10,512,173

WIRING BOARD


Patent No. 10,512,173
Issue Date December 17, 2019
Title Wiring Board
Inventorship Toshihiro Hiwatashi, Satsumasendai (JP)
Rintaro Kamimura, Satsumasendai (JP)
Assignee Kyocera Corporation, Kyoto (JP)

Claim of US Patent No. 10,512,173

1. A wiring board comprising:an insulating base having a first surface including a mounting region for mounting a semiconductor integrated circuit element and a second surface connected to an external board, the insulating base in which a plurality of insulating layers are laminated;
a power supply conductor including on the first surface:
a first planar conductor positioned in one side region around the mounting region, and
a plurality of first linear conductors protruding from the first planar conductor into the mounting region in a comb-shaped state, the plurality of first linear conductors to which a plurality of respective power supply electrodes of the semiconductor integrated circuit element are connected;
a grounding conductor including on the first surface:
a second planar conductor positioned in a region opposite to the one side region around the mounting region, and
a plurality of second linear conductors protruding from the second planar conductor into the mounting region in a comb-shaped state to be alternately adjacent to the first linear conductors, the plurality of second linear conductors to which a plurality of respective grounding electrodes of the semiconductor integrated circuit element are connected;
a plurality of power supply terminals, on the second surface, positioned in a first region overlapping with the first planar conductor in a plan perspective view, the plurality of power supply terminals being electrically connected to the first planar conductor through a first through conductor penetrating each of the plurality of insulating layers between the first planar conductor and the first region; and
a plurality of grounding terminals, on the second surface, positioned in a second region overlapping with the second planar conductor in a plan perspective view, the plurality of grounding terminals being electrically connected to the second planar conductor through a second through conductor penetrating each of the plurality of insulating layers between the second planar conductor and the second region.