US Patent No. 10,512,172


Patent No. 10,512,172
Issue Date December 17, 2019
Title System For Pressing Pre-tin Shaping
Inventorship Hongzhou Shen, Shanghai (CN)
Dandan Zhang, Shanghai (CN)
Qinglong Zeng, Shanghai (CN)
Roberto Francisco-Yi Lu, Berwyn, PA (US)
George Dubniczki, Shanghai (CN)
Assignee Tyco Electronics (Dongguan) Co., Ltd., Dongguan (CN) Tyco Electronics (Sha...

Claim of US Patent No. 10,512,172

1. A pre-tin shaping system, comprising:a base securely holding a circuit board having a pre-tin layer;
a heat-press unit having a contact tip; and
a movable unit moving the heat-press unit relative to the base, the contact tip movable to shape the pre-tin layer to correspond to a shape of the contact tip, only the pre-tin layer is disposed between the circuit board and the contact tip when the contact tip shapes the pre-tin layer.