US Patent No. 10,512,170

HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD


Patent No. 10,512,170
Issue Date December 17, 2019
Title Highly Conductive Transparent Glass-based Circuit Board
Inventorship Lianjia Liu, Hubei (CN)
Qingliang Guo, Hubei (CN)
Xiaojiang You, Hubei (CN)
Assignee WUHAN HUASHANG GREEN TECHNOLOGY CO., LTD., Wuhan, Hubei (CN)

Claim of US Patent No. 10,512,170

1. A highly conductive transparent glass-based circuit board, comprising:a glass substrate, being a glass-tempered substrate,
wherein a surface of the glass-tempered substrate faces air, and a conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate;
wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion;
wherein a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer;
wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75:3:5 to 10:10 to 20:1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder; and
wherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste.