1. A highly conductive transparent glass-based circuit board, comprising:a glass substrate, being a glass-tempered substrate,
wherein a surface of the glass-tempered substrate faces air, and a conductive paste, printed on the surface of the glass-tempered substrate, is baked, heated, and cooled to form a conductive circuit fused with the surface of the glass substrate;
wherein the conductive circuit is made essentially of a graphene layer or a conductive layer having a graphene upper portion and a metal lower portion fused with the glass substrate, and a surface of the graphene upper portion is fused with a surface of the metal lower portion;
wherein a surface of the conductive circuit, except a region reserved for a solder pad used for welding a component, is covered with a printed-circuit-board (PCB) organic solder-resistant layer;
wherein the conductive paste includes conductive powder, low temperature glass powder, ethyl cellulose, terpineol, and dibutyl maleate at a mass ratio of 65 to 75:3:5 to 10:10 to 20:1 to 3, and the conductive powder is graphene powder or a mixture of metal powder and graphene powder; and
wherein, when the conductive powder is the mixture of metal powder and graphene powder, the graphene powder accounts for 2% to 5% by mass of the conductive paste.