US Patent No. 10,512,167

REMOVING UNWANTED FLUX FROM AN INTEGRATED CIRCUIT PACKAGE


Patent No. 10,512,167
Issue Date December 17, 2019
Title Removing Unwanted Flux From An Integrated Circuit Package
Inventorship Russell L. Steiner, St. Helen, MI (US)
Assignee Schlage Lock Company LLC, Carmel, IN (US)

Claim of US Patent No. 10,512,167

1. A surface-mounted integrated circuit (IC) package, comprising: at least one bottom termination component (BTC) including a plurality of lands and a thermal pad, wherein the plurality of lands provides an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC, and wherein the thermal pad includes a plurality of vias configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled; and a printed circuit board (PCB) mounted to the BTC and electrically connected to the BTC via the plurality of lands, wherein the PCB receives the heat transfer from the BTC via the thermal pad and includes at least one reservoir, and wherein the at least one reservoir is configured to pull flux positioned between the plurality of lands into the at least one reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled, wherein the plurality of vias are positioned in a staggered row and column formation so that each row of vias is not aligned with each immediate adjacent row of vias and each column of vias is not aligned with each immediate column of vias.