US Patent No. 10,512,166

MANUFACTURING METHOD OF CIRCUIT BOARD AND STAMP


Patent No. 10,512,166
Issue Date December 17, 2019
Title Manufacturing Method Of Circuit Board And Stamp
Inventorship Shih-Lian Cheng, New Taipei (TW)
Assignee Unimicron Technology Corp., Taoyuan (TW)

Claim of US Patent No. 10,512,166

1. A manufacturing method of a circuit board, comprising:providing a dielectric substrate, wherein a circuit pattern, a dielectric layer covering the circuit pattern, and a conductive via located in the dielectric layer and connected to the circuit pattern are disposed on the dielectric substrate;
forming a photoresist material layer on the dielectric layer;
performing an imprinting process on the photoresist material layer via a stamp to form a patterned photoresist layer, wherein a pressing side of the stamp facing the circuit pattern becomes sticky when subjected to a pressure so as to completely catch and remove a photoresist residue from the photoresist material layer in the imprinting process, wherein a material of the pressing side is a pressure-sensitive adhesive material, and the pressure-sensitive adhesive material becomes sticky when subjected to the pressure;
forming a patterned metal layer on a region exposed by the patterned photoresist layer; and
removing the patterned photoresist layer.