US Patent No. 10,512,165

METHOD FOR MANUFACTURING A CIRCUIT BOARD


Patent No. 10,512,165
Issue Date December 17, 2019
Title Method For Manufacturing A Circuit Board
Inventorship Ching-Hao Huang, Taoyuan (TW)
Ho-Shing Lee, Taoyuan (TW)
Yu-Cheng Lin, New Taipei (TW)
Assignee UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)

Claim of US Patent No. 10,512,165

1. A method for manufacturing a circuit board, the method comprising:forming a first metal layer on a substrate and forming a second metal layer on the first metal layer, wherein the first metal layer is formed from a first material, and the second metal layer is formed from a second material that is different from the first material;
forming a pattern layer on the second metal layer and forming a third metal layer on the second metal layer through the pattern layer, wherein the third metal layer is formed from a third material that is the same as the second material; and
removing the pattern layer and a portion of the second metal layer, wherein a combination of the remained second metal layer and the third metal layer becomes a circuit layer, wherein the first metal layer is formed from a first metal material, and the circuit layer is formed from a second metal material of which optical reflectivity of the first metal material is different from optical reflectivity of the second metal material.