US Patent No. 10,512,163


Patent No. 10,512,163
Issue Date December 17, 2019
Title Electronic Component Mounting Board
Inventorship Kazuo Ishizaki, Tokyo (JP)
Assignee TDK CORPORATION, Tokyo (JP)

Claim of US Patent No. 10,512,163

1. An electronic component mounting board comprising:a circuit board having (1) a wiring layer that includes a first insulating layer, a second insulating layer, and a conductor layer between the first insulating layer and the second insulating layer and (2) a recess in a main surface of one side of the circuit board, the main surface being on a same side of the conductor layer as the first insulating layer;
a passive component located in the recess;
an active component arranged above the passive component and the main surface of the one side of the circuit board and connected to the passive component; and
a shield layer formed of a material containing a magnetic material and provided between a bottom surface of the recess and a lower surface of the passive component;
wherein the recess extends through the first insulating layer and the conductor layer such that the bottom surface of the recess is the second insulating layer.