US Patent No. 10,512,160

CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREFOR


Patent No. 10,512,160
Issue Date December 17, 2019
Title Conductive Structure And Manufacturing Method Therefor
Inventorship Ilha Lee, Daejeon (KR)
Ki-Hwan Kim, Daejeon (KR)
Song Ho Jang, Daejeon (KR)
Jin Woo Park, Daejeon (KR)
Chan Hyoung Park, Daejeon (KR)
Assignee LG CHEM, LTD., Seoul (KR)

Claim of US Patent No. 10,512,160

1. A conductive structure body comprising:a substrate; and
a conductive line configuring a screen part, a wiring part, and a pad part provided on the substrate,
wherein the conductive line includes a first metal layer, a light reflection reducing layer provided on the first metal layer, and a second metal layer provided on the light reflection reducing layer,
wherein the light reflection reducing layer includes metal oxynitride, and
wherein a thickness of the second metal layer is 6 nm or more and less than 10 nm,
wherein the screen part includes a conductive pattern including a plurality of openings and the conductive line partitioning the openings, and
wherein a line gap between adjacent conductive lines in the conductive line configuring the screen part is 0.1 ?m or more and 100 ?m or less; and
wherein a thickness of the first metal layer is 10 nm or more and 1 ?m or less.