US Patent No. 10,512,158

FLEXIBLE CIRCUIT BOARD WITH IMPROVED BONDING POSITION ACCURACY


Patent No. 10,512,158
Issue Date December 17, 2019
Title Flexible Circuit Board With Improved Bonding Position Accuracy
Inventorship Sang Pil Kim, Hwaseong-si (KR)
Byung Hoon Jo, Hwaseong-si (KR)
Byung Yeol Kim, Hwaseong-si (KR)
Hee seok Jung, Hwaseong-si (KR)
Assignee GigaLane Co., Ltd., Hwaseong-si, Gyeonggi-Do (KR)

Claim of US Patent No. 10,512,158

1. A flexible circuit board with improved bonding position accuracy, comprising:a signal line disposed between a first ground and a second ground;
a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and
a cover layer disposed directly contacting the first ground and having a plurality of pairs of openings formed therein such that the first ground is exposed at certain intervals, wherein each pair of the plurality of pairs of openings comprises a first opening and a second opening having same area, each of the first opening and the second opening has a trapezoid shape, and the first opening and the second opening are formed along the same line of a longitudinal direction of the cover layer, and the cover layer further comprises a plurality of position alignment portions, each of the plurality of position alignment portions disposed between the first opening and the second opening of each pair of the plurality of pairs of openings, and each of the plurality of position alignment portions is a rectangular strip formed at an angle with respect to a longitudinal direction of the signal line.