US Patent No. 10,512,155

WIRING BOARD, OPTICAL SEMICONDUCTOR ELEMENT PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE


Patent No. 10,512,155
Issue Date December 17, 2019
Title Wiring Board, Optical Semiconductor Element Package, And Optical Semiconductor Device
Inventorship Toshihiko Kitamura, Omihachiman (JP)
Assignee KYOCERA Corporation, Kyoto-Shi, Kyoto (JP)

Claim of US Patent No. 10,512,155

1. A wiring board, comprising:a first dielectric layer having a rectangular plate form;
a ground conductor wiring which is positioned on a first face of the first dielectric layer and is connected to a ground potential, a first end portion of the ground conductor wiring extending to a first side of the first face;
a pair of signal conductor wirings which is positioned on the first face of the first dielectric layer and carries out signal transmission, the pair of signal conductor wirings being positioned along the ground conductor wiring keeping a predetermined distance from the ground conductor wiring on both sides in a width direction of the ground conductor wiring, first end portions of the pair of signal conductor wirings extending to the first side of the first face;
a ground conductor layer which is positioned on a second face of the first dielectric layer and is connected to the ground potential, a region of the ground conductor layer where the first end portions of the pair of signal conductor wirings are positioned in plan view being cut away inwardly from a first side of the second face opposing the first side of the first face; and
a second dielectric layer having a rectangular plate form, the second dielectric layer being positioned on a side of the ground conductor layer opposite to the first dielectric layer.