US Patent No. 10,512,153

HIGH FREQUENCY CIRCUIT


Patent No. 10,512,153
Issue Date December 17, 2019
Title High Frequency Circuit
Inventorship Hidenori Ishibashi, Tokyo (JP)
Kiyoshi Ishida, Tokyo (JP)
Eigo Kuwata, Tokyo (JP)
Yukinobu Tarui, Tokyo (JP)
Hideharu Yoshioka, Tokyo (JP)
Hiroyuki Aoyama, Tokyo (JP)
Masaomi Tsuru, Tokyo (JP)
Assignee MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)

Claim of US Patent No. 10,512,153

1. A high frequency circuit comprising: a substrate that includes a first dielectric layer having an opening which penetrates the first dielectric layer in a layer thickness direction, second dielectric layers laminated on a lower surface and an upper surface of the first dielectric layer, and a plurality of conductor layers provided in the first dielectric layer and at least one of the second dielectric layers; a first high frequency device that is placed within the opening, the first high frequency device being installed such that a device back surface opposite a terminal surface is thermally and closely connected to a conductor layer for heat dissipation out of the plurality of conductor layers, the conductor layer for heat dissipation provided at a lower surface side of the first dielectric layer, and terminals on the terminal surface are electrically connected to terminal conductor layers out of the plurality of conductor layers through a first via hole provided in the at least one of the second dielectric layers, the terminal conductor layers being formed on an upper surface side of the first dielectric layer; and a second high frequency device that is installed such that a terminal surface thereof faces a surface layer of the upper surface side of the first dielectric layer in the substrate and that the terminals on the terminal surface are electrically connected to the terminal conductor layers, wherein the first and second high frequency devices are disposed at different positions in a planar direction on the substrate, and wherein signal terminals of the first and second high frequency devices are separated by a ground terminal.