US Patent No. 10,512,152

DEVICE ARRAY BACKFRAME WITH INTEGRAL MANIFOLDING FOR HIGH PERFORMANCE FLUID COOLING


Patent No. 10,512,152
Issue Date December 17, 2019
Title Device Array Backframe With Integral Manifolding For High Performance Fluid Cooling
Inventorship James Paul Smith, Chelmsford, MA (US)
Bernard A. Malouin, Jr., Westford, MA (US)
Eric A. Browne, Westford, MA (US)
Kenneth L. Smith, Littleton, MA (US)
Assignee Massachusetts Institute of Technology, Cambridge, MA (US)

Claim of US Patent No. 10,512,152

1. An array backframe, comprising:a supply manifold comprising a fluid inlet and a supply cavity in communication with the fluid inlet;
an exhaust manifold comprising an exhaust cavity and a plurality of openings and drainage openings on a top surface, wherein the plurality of openings are in communication with the supply cavity and the drainage openings are in communication with the exhaust cavity; and
a low conductivity layer, disposed between the supply manifold and the exhaust manifold to physically separate and thermally isolate the supply cavity and the exhaust cavity, wherein the supply manifold, the low conductivity layer and the exhaust manifold are three separate layers, and are configured such that the exhaust manifold is disposed on top of the low conductivity layer and the low conductivity layer is disposed on top of the supply manifold; and
wherein the exhaust manifold comprises a plurality of hollow projections extending downward from the openings on the top surface, wherein the hollow projections pass through conduits in the low conductivity layer and terminate in the supply cavity such that the openings on the top surface are in fluid communication with the supply cavity.