US Patent No. 10,507,552


Patent No. 10,507,552
Issue Date December 17, 2019
Title Solder Material And Electronic Component
Inventorship Toshimasa Tsuda, Saitama (JP)
Kenichi Kikuchi, Saitama (JP)
Tomotaka Kuroda, Saitama (JP)
Daisuke Nishiyama, Saitama (JP)
Hiroyuki Sasaki, Saitama (JP)
Makoto Hatano, Saitama (JP)
Hiroya Ishikawa, Saitama (JP)
Assignee NIHON DEMPA KOGYO CO., LTD., Tokyo (JP)

Claim of US Patent No. 10,507,552

1. A solder material, comprising:an alloy of at least five elements including Sn, Cu, Sb, In, and 20 mass % or less of Ag, wherein
a solidus temperature of the solder material is higher than 290° C., a liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and a temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less, and
the solder material includes 36 to 40 mass % of Sn, 34 to 38 mass % of Sb, 4 to 6 mass % of Cu, 4 to 6 mass % of In, a remaining portion of Ag, and inevitable impurities.