US Patent No. 10,490,710

HYBRID CHIP-ON-BOARD LED MODULE WITH PATTERNED ENCAPSULATION


Patent No. 10,490,710
Issue Date November 26, 2019
Title Hybrid Chip-on-board Led Module With Patterned Encapsulation
Inventorship Wouter Anthon Soer, Palo Alto, CA (US)
Rene Helbing, Palo Alto, CA (US)
Guan Huang, Santa Clara, CA (US)
Assignee Lumileds LLC, San Jose, CA (US)

Claim of US Patent No. 10,490,710

1. A lighting module comprising:a first plurality of light emitting elements that emit a first color;
a second plurality of light emitting elements that emit a second color;
a substrate upon which the first and second pluralities of light emitting elements are arranged; and
an encapsulation layer that includes a first encapsulant positioned over each of the light emitting elements of the first plurality of light emitting elements and a second encapsulant positioned over each of the light emitting elements of the second plurality of light emitting elements and comprising a plurality of domes, the first encapsulant further includes a concentration of wavelength conversion material that is substantially greater than a concentration of wavelength conversion material in the second encapsulant and fills regions between the domes.