US Patent No. 10,490,710
HYBRID CHIP-ON-BOARD LED MODULE WITH PATTERNED ENCAPSULATION
| Patent No. | 10,490,710 |
|---|---|
| Issue Date | November 26, 2019 |
| Title | Hybrid Chip-on-board Led Module With Patterned Encapsulation |
| Inventorship | Wouter Anthon Soer, Palo Alto, CA (US) Rene Helbing, Palo Alto, CA (US) Guan Huang, Santa Clara, CA (US) |
| Assignee | Lumileds LLC, San Jose, CA (US) |
Claim of US Patent No. 10,490,710
1. A lighting module comprising:a first plurality of light emitting elements that emit a first color;
a second plurality of light emitting elements that emit a second color;
a substrate upon which the first and second pluralities of light emitting elements are arranged; and
an encapsulation layer that includes a first encapsulant positioned over each of the light emitting elements of the first plurality of light emitting elements and a second encapsulant positioned over each of the light emitting elements of the second plurality of light emitting elements and comprising a plurality of domes, the first encapsulant further includes a concentration of wavelength conversion material that is substantially greater than a concentration of wavelength conversion material in the second encapsulant and fills regions between the domes.
a second plurality of light emitting elements that emit a second color;
a substrate upon which the first and second pluralities of light emitting elements are arranged; and
an encapsulation layer that includes a first encapsulant positioned over each of the light emitting elements of the first plurality of light emitting elements and a second encapsulant positioned over each of the light emitting elements of the second plurality of light emitting elements and comprising a plurality of domes, the first encapsulant further includes a concentration of wavelength conversion material that is substantially greater than a concentration of wavelength conversion material in the second encapsulant and fills regions between the domes.