US Patent No. 10,485,149

COMPOSITE FORMULATION AND COMPOSITE ARTICLE


Patent No. 10,485,149
Issue Date November 19, 2019
Title Composite Formulation And Composite Article
Inventorship Megan Hoarfrost Beers, Belmont, CA (US)
Jialing Wang, Mountain View, CA (US)
Jaydip Das, Cupertino, CA (US)
Richard B. Lloyd, Sunnyvale, CA (US)
James Toth, San Carlos, CA (US)
Ting Gao, Palo Alto, CA (US)
Assignee TE CONNECTIVITY CORPORATION, Berwyn, PA (US)

Claim of US Patent No. 10,485,149

1. A composite article, comprisingat least two layers of a composite formulation, the composite formulation of each layer including a thermoplastic polymer matrix and conductive particles distributed within the polymer matrix, the conductive particles including a concentration of, by volume, between 20% and 50% of the composite formulation; wherein the conductive particles comprise tin-coated copper particles having a copper/tin volume ratio of between 3/1 and 3/2;
wherein the conductive particles in each of the at least two layers include at least one morphology selected from the group consisting of fibrous, dendritic, and flake; and
wherein the morphology of the conductive particles in one of the at least two layers differs from the morphology of the conductive particles in another one of the at least two layers.