US Patent No. 10,485,143

COLD PLATE ASSEMBLY FOR SERVER LIQUID COOLING OF ELECTRONIC RACKS OF A DATA CENTER


Patent No. 10,485,143
Issue Date November 19, 2019
Title Cold Plate Assembly For Server Liquid Cooling Of Electronic Racks Of A Data Center
Inventorship Tianyi Gao, Santa Clara, CA (US)
Yan Cui, San Jose, CA (US)
Assignee BAIDU USA LLC, Sunnyvale, CA (US)

Claim of US Patent No. 10,485,143

1. A cooling module assembly for cooling a processor of a data processing system in an electronic rack of a data center, the cooling module assembly comprising:a cold plate to be positioned adjacent to an exterior surface of a processor to receive heat radiated from the processor;
a liquid distribution channel formed within the cold plate to distribute a cooling liquid through the cold plate to exchange the heat carried by the cold plate, wherein the liquid distribution channel includes
an ingress port to be coupled a liquid supply line to receive the cooling liquid from an external liquid source, wherein the ingress port is disposed on a first edge of the cold plate, and
an egress port to be coupled to a liquid return line to return the cooling liquid having the exchanged heat back to the external liquid source, wherein the egress port is disposed on a second edge of the cold plate opposite to the first edge; and
a cold plate mounting bracket attached to the cold plate to mount the cold plate onto the external surface of the processor, wherein the cold plate mounting bracket includes a first set of mounting slots to be aligned with a second set of mounting slots disposed on a processor mounting bracket that mounts the processor onto a motherboard of the data processing system,
wherein the first set of mounting slots is disposed on a third edge of the cold plate mounting bracket and the second set of mounting slots is disposed on a fourth edge of the cold plate mounting bracket opposite to the third edge, wherein the third edge and the fourth edge are different edges than the first and second edges,
wherein the third edge of the cold plate mounting bracket further comprises a first set of one or more aligning guide pins disposed thereon and extended downwardly, and the fourth edge of the cold plate mounting bracket further comprises a second set of one or more aligning guide pins disposed thereon and extended downwardly,
wherein when the cold plate mounting bracket together with the cold plate is mounted onto the processor mounting bracket, the aligning guide pins of the first set and second set are inserted into corresponding guide pin holes disposed on the processor mounting bracket, such that the mounting slots of the cold plate mounting bracket are aligned with the mounting slots of the processor mounting bracket,
wherein the first set of mounting slots and the second set of mounting slots allow one or more mounting pins to be inserted therethrough in a first angle and to rotate from the first angle to a second angle after the insertion to interlock the cold plate with the exterior surface of the processor;
wherein each mounting pin is configured to insert through a center of a spring in order to insert through a corresponding mounting slot of the first set such that the spring is compressed when the mounting pin is in a locked position, thereby providing a force to push the cold plate mounting bracket and the processor mounting bracket together so as to provide adequate contact between the cold plate and the processor.