US Patent No. 10,485,139

POWER MODULE, THERMAL DISSIPATION STRUCTURE OF THE POWER MODULE AND CONTACT METHOD OF THE POWER MODULE


Patent No. 10,485,139
Issue Date November 19, 2019
Title Power Module, Thermal Dissipation Structure Of The Power Module And Contact Method Of The Power Module
Inventorship Katsuhiko Yoshihara, Kyoto (JP)
Assignee ROHM CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,485,139

1. A power module in which a plurality of switching elements connected in series between a first power terminal and a second power terminal and a circuit configured to connect connecting points thereof to an output terminal are formed, the power module comprising:a heat radiation plate to which the switching elements are contacted;
a sealing body configured to seal a perimeter of the plurality of switching elements and a part of each of the first and second power terminals and the output terminal so as to expose at least one portion of the heat radiation plate;
a regulating portion formed on the sealing body, the regulating portion configured to regulate a thickness of a thermally-conductive material when contacting the heat radiation plate to a cooling plate facing the heat radiation plate with the thermally-conductive material; and
a protruding portion for positioning protruding from a center portion of the regulating portion, wherein
the regulation portion and the protruding portion for positioning are cylindrical, and a diameter of the protruding portion for positioning is smaller than a diameter of the regulating portion.