US Patent No. 10,485,138

HEAT SINK ASSEMBLIES FOR TRANSIENT COOLING


Patent No. 10,485,138
Issue Date November 19, 2019
Title Heat Sink Assemblies For Transient Cooling
Inventorship Michel Engelhardt, Woodbury, NY (US)
Paul Otto Stehlik, Northport, NY (US)
Judd Everett Swanson, Cooper City, FL (US)
Assignee GE Aviation Systems LLC, Grand Rapids, MI (US)

Claim of US Patent No. 10,485,138

2. A heat sink assembly for use with at least one heat-emitting component, comprising:a first frame holding a first phase change material that changes phase at a first temperature where the first frame has at least a portion conductively coupled to the at least one heat-emitting component;
a second frame holding a second phase change material that changes phase at a second temperature, which is greater than the first temperature; and
a conductive element defining a structural barrier between the first phase change material and the second phase change material and conductively coupling the first phase change material and the second phase change material;
wherein the first frame and the second frame are configured as honeycombs and the first phase change material changes phase in response to a conductive transfer of heat from the heat-emitting component and the second phase change material changes phase in response to a conductive transfer of heat from the first phase change material.