US Patent No. 10,485,130


Patent No. 10,485,130
Issue Date November 19, 2019
Title Surface Mount Type Device And Manufacturing Method For The Same
Inventorship Masato Ogawa, Saitama (JP)
Assignee NIHON DEMPA KOGYO CO., LTD., Tokyo (JP)

Claim of US Patent No. 10,485,130

1. A surface mount type device, comprising:an electronic component;
a main substrate on which the electronic component is mounted;
a pedestal on which the main substrate is mounted, wherein the pedestal has an outer frame portion and a beam portion which connects two long sides of the outer frame portion;
a lower substrate on which the pedestal is mounted;
a cover mounted on the lower substrate so as to cover the pedestal, wherein
a soldering pattern soldered with the cover from a region where the cover is mounted to an inside of the lower substrate, on the lower substrate; and
the pedestal includes a cut-out portion disposed in a side surface portion of the outer frame portion so as to form a space above the soldering pattern, the cut-out portion is configured not to penetrate the side surface portion of the outer frame portion, and the soldering pattern extends from a region outside of the pedestal to the space formed by the cut-out portion, and
the cover is secured to the soldering pattern by a solder formed in the space.