1. A surface mount type device, comprising:an electronic component;
a main substrate on which the electronic component is mounted;
a pedestal on which the main substrate is mounted, wherein the pedestal has an outer frame portion and a beam portion which connects two long sides of the outer frame portion;
a lower substrate on which the pedestal is mounted;
a cover mounted on the lower substrate so as to cover the pedestal, wherein
a soldering pattern soldered with the cover from a region where the cover is mounted to an inside of the lower substrate, on the lower substrate; and
the pedestal includes a cut-out portion disposed in a side surface portion of the outer frame portion so as to form a space above the soldering pattern, the cut-out portion is configured not to penetrate the side surface portion of the outer frame portion, and the soldering pattern extends from a region outside of the pedestal to the space formed by the cut-out portion, and
the cover is secured to the soldering pattern by a solder formed in the space.