US Patent No. 10,485,118

MULTI-PART FLEXIBLE ENCAPSULATION HOUSING FOR ELECTRONIC DEVICES AND METHODS OF MAKING THE SAME


Patent No. 10,485,118
Issue Date November 19, 2019
Title Multi-part Flexible Encapsulation Housing For Electronic Devices And Methods Of Making The Same
Inventorship Brian Elolampi, Belmont, MA (US)
David G. Garlock, Derry, NH (US)
Harold Gaudette, Cumberland, RI (US)
Steven Fastert, Chelmsford, MA (US)
Adam Standley, Boston, MA (US)
Yung-Yu Hsu, San Jose, CA (US)
Assignee MC10, Inc., Lexington, MA (US)

Claim of US Patent No. 10,485,118

1. A conformal integrated circuit (IC) device comprising:a flexible substrate;
an electronic circuitry attached to the flexible substrate; and
a flexible multi-part encapsulation housing at least substantially encasing therein the electronic circuitry and the flexible substrate, the multi-part encapsulation housing including a first encapsulation housing component attached to a second encapsulation housing component, the first encapsulation housing component having at least one first recessed region for seating therein the electronic circuitry, and the second encapsulation housing component having at least one second recessed region for seating therein the flexible substrate,
wherein the electronic circuitry includes a plurality of device islands and a plurality of stretchable electrical interconnects electrically connecting two or more of the device islands.