US Patent No. 10,485,110

ELECTRICAL CONNECTION METHOD OF PRINTED CIRCUIT AND ELECTRICAL CONNECTION STRUCTURE OF PRINTED CIRCUIT


Patent No. 10,485,110
Issue Date November 19, 2019
Title Electrical Connection Method Of Printed Circuit And Electrical Connection Structure Of Printed Circuit
Inventorship Mizuki Shirai, Susono (JP)
Hiroki Kondo, Susono (JP)
Assignee Yazaki Corporation, Minato-ku, Tokyo (JP)

Claim of US Patent No. 10,485,110

1. An electrical connection method of a printed circuit, comprising:overlapping a base material and a thin member in which a thin conductor is mounted;
forming a through hole which passes through the base material overlapped with the thin member, and reaches the thin conductor of the thin member; and
forming the printed circuit on the base material by a screen printing method using conductive paste,
wherein the through hole is filled with the conductive paste in the forming of the printed circuit,
wherein the thin member is a flat shield cable covered with a shield member except one portion of the thin member,
wherein in the forming of the through hole, a first through hole is formed to pass through the base material overlapped in the overlapping and to open the one portion of the thin member so as to reach the thin conductor, and a second through hole is formed to pass through the base material overlapped in the overlapping to reach the shield member, and
wherein in the forming of the printed circuit, the first through hole is filled with the conductive paste when a signal line is formed as a first printed circuit on the base material, and the second through hole is filled with the conductive paste when a ground line is formed as a second printed circuit on the base material at the same time as the signal line is formed.