US Patent No. 10,485,104

PRINTED CIRCUIT BOARD, MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME


Patent No. 10,485,104
Issue Date November 19, 2019
Title Printed Circuit Board, Memory Module And Memory System Including The Same
Inventorship Jong-Min Kim, Suwon-si (KR)
Do-Hyung Kim, Hwaseong-si (KR)
Kyoung-Sun Kim, Uijeongbu-si (KR)
Assignee SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)

Claim of US Patent No. 10,485,104

1. A printed circuit board (PCB) comprising:a first insulating layer;
a pad disposed on the first insulating layer;
a first reference layer on which the first insulating layer is disposed, the first reference layer comprising:
a dielectric passage disposed through the first reference layer, and for forming a return path of a signal that is transmitted to the pad; and
a conductive line disposed in and through the dielectric passage, and for forming a transmission path of the signal;
a second insulating layer on which the first reference layer is disposed; and
a second reference layer on which the second insulating layer is disposed, the second reference layer further forming the return path,
wherein a capacitance of the pad corresponds to a distance between the pad and the second reference layer.