US Patent No. 10,485,098

ELECTRONIC COMPONENT DEVICE


Patent No. 10,485,098
Issue Date November 19, 2019
Title Electronic Component Device
Inventorship Shota Miki, Nagano (JP)
Assignee SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi (JP)

Claim of US Patent No. 10,485,098

1. An electronic component device comprising:a wiring board comprising:
a core substrate having a first surface and a second surface;
a first multilayer wiring layer disposed on the first surface of the core substrate, the first multilayer wiring layer comprising an insulating layer and a plurality of pads exposed from the insulating layer;
a second multilayer wiring layer disposed on the second surface of the core substrate;
an electronic component module comprising:
an insulating base material comprising a first insulating base material layer and a second insulating base material layer, wherein the second insulating base material layer is disposed on a first surface of the first insulating base material layer with a second surface of the second insulating base material layer facing the first surface of the first insulating base material layer, a first surface of the second insulating base material layer is opposite to the second surface of the second insulating base material layer, and a second surface of the first insulating base material layer is opposite to the first surface of the first insulating base material layer and defines a surface of the electronic component module;
an electronic component embedded in the first insulating base material layer of the insulating base material, wherein an electrode of the electronic component is exposed from the second surface of the first insulating base material layer, and the first insulating base material layer has an opening portion which is formed in a region outside the electronic component;
a wiring layer comprising a wiring portion formed on the first surface of the first insulating base material layer and a second wiring layer disposed on the first surface of the second insulating base material layer;
a columnar conductor which is connected to the wiring portion and embedded in the opening portion;
a plurality of connection terminals each connected to a corresponding one of the pads, wherein at least one of the plurality of connection terminals is electrically connected to the electrode of the electronic component, and at least one of the plurality of connection terminals is electrically connected to the columnar conductor;
a solder resist layer formed on the first surface of the second insulating base material layer, the solder resist layer having a solder resist layer opening portion defined therethrough, the solder resist layer opening portion exposing a portion of the second wiring layer from the solder resist layer; and
a sealing resin provided between the insulating base material of the electronic component module and the wiring board such that an entirety of the insulating base material of the electronic component module is spaced from the insulating layer of the wiring board with the sealing resin disposed therebetween,
wherein a content rate of filler contained in the sealing resin is higher than that of filler contained in the insulating layer and that of filler contained in the insulating base material wherein a content rate of electrically nonconductive filler contained in the sealing resin is higher than that of electrically nonconductive filler contained in the insulating layer and that of electrically nonconductive tiller contained in the insulating base material; and
wherein the content rate of electrically nonconductive filler contained in the insulating layer and the content rate of electrically nonconductive filler contained in the insulating base material are greater than zero.