US Patent No. 10,485,097

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS


Patent No. 10,485,097
Issue Date November 19, 2019
Title Backplane Footprint For High Speed, High Density Electrical Connectors
Inventorship Marc Robert Charbonneau, Bedford, NH (US)
Jose Ricardo Paniagua, Newmarket, NH (US)
Assignee Amphenol Corporation, Wallingford, CT (US)

Claim of US Patent No. 10,485,097

1. A printed circuit board comprising:a plurality of layers including attachment layers and routing layers; and
columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising:
first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers to at least one breakout layer of the routing layers;
at least one antipad surrounding the first and second signal vias; and
first and second conductive shadow vias located between the first and second signal vias of the differential pair on a first line that is perpendicular to a second line through the first and second signal vias and that is midway between the first and second signal vias.