US Patent No. 10,485,094

MULTILAYER STRUCTURE WITH EMBEDDED SENSING FUNCTIONALITIES AND RELATED METHOD OF MANUFACTURE


Patent No. 10,485,094
Issue Date November 19, 2019
Title Multilayer Structure With Embedded Sensing Functionalities And Related Method Of Manufacture
Inventorship Hasse Sinivaara, Oulunsalo (FI)
Heikki Tuovinen, Oulunsalo (FI)
Ville Wallenius, Oulunsalo (FI)
Tomi Simula, Oulunsalo (FI)
Mikko Heikkinen, Oulunsalo (FI)
Minna Pirkonen, Oulunsalo (FI)
Tuukka Junkkari, Oulunsalo (FI)
Janne Asikkala, Oulunsalo (FI)
Assignee TACTOTEK OY, Oulunsalo (FI)

Claim of US Patent No. 10,485,094

1. An integrated multilayer structure suitable for use in sensing applications, the multilayer structure comprising:at least one plastic layer having a first side and a second side opposite the first side;
at least one film layer provided on both of the first and second sides of the at least one plastic layer;
the at least one film layer on the first side of the at least one plastic layer comprising electronics incorporating reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, the sensing electronics comprising at least one electrode and a galvanic connection element configured to connect the electrode to an associated control circuitry driving the at least one electrode; and
the at least one film layer on the second side of the at least one plastic layer comprising one or more features including at least one conductive feature, the one or more features being configured to shape an electromagnetic field to adapt a sensitivity or a directionality of a sensing response of the sensing electronics on the first side of the at least one plastic layer.