US Patent No. 10,485,093

FLEXIBLE PRINTED BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED BOARD


Patent No. 10,485,093
Issue Date November 19, 2019
Title Flexible Printed Board And Method For Manufacturing Flexible Printed Board
Inventorship Satoshi Ebihara, Tokyo (JP)
Takahisa Kato, Tokyo (JP)
Nobuto Sasaki, Tokyo (JP)
Kazuyuki Azuma, Tokyo (JP)
Tomohiro Shimokawaji, Tokyo (JP)
Takeo Wakabayashi, Tokyo (JP)
Assignee NIPPON MEKTRON, LTD., Tokyo (JP)

Claim of US Patent No. 10,485,093

1. A flexible printed board on which a power consuming load is mounted, comprising:a front surface heat dissipation layer made of a copper foil and having a circuit portion on which the load is mounted;
a thermally conductive resin layer having the front surface heat dissipation layer laminated to a front surface side thereof and having a thermal conductivity of 0.49 W/mK or more, the front surface heat dissipation layer being arranged between the power consuming load and the thermally conductive resin layer with respect to a thickness direction, the front surface heat dissipation layer being directly contact with a front surface side of the thermally conductive resin layer; and
a rear surface heat dissipation layer made of a copper foil, laminated to and in direct contact with a rear surface side of the thermally conductive resin layer, and having a thickness of 100 to 400% with respect to the front surface heat dissipation layer.