US Patent No. 10,485,092


Patent No. 10,485,092
Issue Date November 19, 2019
Title Multilayer Bus Board
Inventorship Richard Schneider, Livonia, MI (US)
Joseph J. Lynch, East Northport, NY (US)
Assignee INTERPLEX INDUSTRIES, INC., East Providence, RI (US)

Claim of US Patent No. 10,485,092

1. A multilayer bus board comprising:a multilayer stacked assembly having a plurality of layers including a pair of electrically conductive layers and a dielectric layer disposed between and adjoining each of the conductive layers; and
a molded frame formed of an insulating polymer material, the frame having a peripheral portion encapsulating end portions of the dielectric layer and the conductive layers to maintain the conductive layers and the dielectric layer in position relative to each other, the frame defining an enlarged opening through which an external surface of an outer one of the layers is exposed.