1. A method for fabricating a microelectronic module, comprising:providing a module substrate including a cavity having metallized sidewalls; and
forming a sinter-bonded heat dissipation structure within the cavity, forming comprising:
inserting a prefabricated thermally-conductive body into the cavity, the prefabricated thermally-conductive body comprising a metallic coin having a plated peripheral surface;
applying a sinter precursor material into the cavity and onto surfaces of the prefabricated thermally-conductive body before, after, or concurrent with insertion of the prefabricated thermally-conductive body into the cavity, the sinter precursor material containing metal particles having a melt point; and
sintering the sinter precursor material at a maximum processing temperature less than the melt point of the metal particles to produce a sinter bond layer bonding the prefabricated thermally-conductive body to the metallized sidewalls of the module substrate, the sinter bond layer contacting and extending around the plated peripheral surface of the metallic coin.