US Patent No. 10,485,091

MICROELECTRONIC MODULES WITH SINTER-BONDED HEAT DISSIPATION STRUCTURES AND METHODS FOR THE FABRICATION THEREOF


Patent No. 10,485,091
Issue Date November 19, 2019
Title Microelectronic Modules With Sinter-bonded Heat Dissipation Structures And Methods For The Fabrication Thereof
Inventorship Jaynal A. Molla, Gilbert, AZ (US)
Lakshminarayan Viswanathan, Phoenix, AZ (US)
Elie A. Maalouf, Mesa, AZ (US)
Geoffrey Tucker, Tempe, AZ (US)
Assignee NXP USA, Inc., Austin, TX (US)

Claim of US Patent No. 10,485,091

1. A method for fabricating a microelectronic module, comprising:providing a module substrate including a cavity having metallized sidewalls; and
forming a sinter-bonded heat dissipation structure within the cavity, forming comprising:
inserting a prefabricated thermally-conductive body into the cavity, the prefabricated thermally-conductive body comprising a metallic coin having a plated peripheral surface;
applying a sinter precursor material into the cavity and onto surfaces of the prefabricated thermally-conductive body before, after, or concurrent with insertion of the prefabricated thermally-conductive body into the cavity, the sinter precursor material containing metal particles having a melt point; and
sintering the sinter precursor material at a maximum processing temperature less than the melt point of the metal particles to produce a sinter bond layer bonding the prefabricated thermally-conductive body to the metallized sidewalls of the module substrate, the sinter bond layer contacting and extending around the plated peripheral surface of the metallic coin.