US Patent No. 10,477,701

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME


Patent No. 10,477,701
Issue Date November 12, 2019
Title Circuit Board And Method For Manufacturing The Same
Inventorship Po-Hsuan Liao, Taoyuan (TW)
Wen-Fang Liu, Taoyuan (TW)
Assignee UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)

Claim of US Patent No. 10,477,701

1. A circuit board, comprising:a substrate comprising a metal-containing board, a ceramic-containing board, or an organic-containing board;
a first dielectric layer disposed on the substrate;
a conductive layer between the substrate and the first dielectric layer;
an adhesive layer bonded to the first dielectric layer and having a first through hole;
a second dielectric layer disposed on the adhesive layer and having a second through hole communicated with the first through hole;
a conductive line located in the first through hole of the adhesive layer and the second through hole of the second dielectric layer and in contact with a top surface of the first dielectric layer; and
a conductive contact passing through the first and second dielectric layers and in contact with a top surface of the conductive layer and the adhesive layer.