US Patent No. 10,462,950

ELECTRONIC COMPONENT BONDING DEVICE AND ELECTRONIC COMPONENT MOUNTER


Patent No. 10,462,950
Issue Date October 29, 2019
Title Electronic Component Bonding Device And Electronic Component Mounter
Inventorship Masaki Murai, Nishio (JP)
Toshihiko Yamasaki, Nisshin (JP)
Toshinori Shimizu, Kariya (JP)
Assignee FUJI CORPORATION, Chiryu-shi (JP)

Claim of US Patent No. 10,462,950

1. An electronic component bonding device for applying pressure to an electronic component loaded on a bonding section of a circuit board so as to bond the electronic component to the bonding section of the circuit board, the electronic component bonding device comprising:multiple pressing tools configured to apply pressure to the electronic component on the bonding section of the circuit board;
a support block configured to support each of the multiple pressing tools via a following mechanism that allows the pressing tool to incline in any direction around 360 degrees; and
a drive mechanism configured to drive the support block in a vertical direction, and, via lowering operation, apply pressure to the electronic component on the bonding section of the circuit board using one of the multiple pressing tools and bond the electronic component to the bonding section of the circuit board, wherein
an upper side of each of the multiple pressing tools includes a round flange section, and
the following mechanism includes a disc-shaped support section that engages with the round flange section to incline the respective pressing tool.