US Patent No. 10,462,939

SEMICONDUCTOR DEVICE


Patent No. 10,462,939
Issue Date October 29, 2019
Title Semiconductor Device
Inventorship Koichi Ushijima, Fukuoka (JP)
Assignee Mitsubishi Electric Corporation, Tokyo (JP)

Claim of US Patent No. 10,462,939

1. A semiconductor device comprising:a cooling jacket having an inlet for coolant and an outlet for the coolant;
a base plate;
a first semiconductor element provided on the base plate;
a second semiconductor element provided on the base plate;
a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket;
a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket; and
a separator provided within the cooling jacket, the separator having a first surface facing a first portion of the back surface of the base plate at which the first fin is provided, and a second surface facing a second portion of the back surface of the base plate at which the second fin is provided, and the separator being configured to divide the coolant entering the cooling jacket through the inlet into portions that pass through a first space between the first surface and the first portion of the back surface of the base plate past the first fin, and through a second space between the second surface and the second portion of the back surface of the base plate past the second fin, to respectively cool the first fin and the second fin,
wherein the separator is a separate structure from the cooling jacket.