1. A method for producing an electronic module assembly, the method comprising:curing a curable first mass extending between a substrate assembly and a module housing while a circuit carrier of the substrate assembly has a temperature of at least a first temperature;
forming an adhesive connection between a side wall of the module housing and the substrate assembly by curing a curable second mass; and
cooling down the circuit carrier subsequent to curing the first mass to below a second temperature lower than the first temperature,
wherein the electronic module is produced such that the circuit carrier comprises a heat exchange surface facing away from the cured first mass, wherein a point of the heat exchange surface opposite the cured first mass comprises, when the electronic module assembly is heated to at least the first temperature, a first distance from a lid of the module housing, wherein the point of the heat exchange surface comprises, when the electronic module assembly is cooled to less than or equal to the second temperature, a second distance from the lid of the module housing, and wherein a difference between the first distance and the second distance is at least 10 ?m.