US Patent No. 10,462,921


Patent No. 10,462,921
Issue Date October 29, 2019
Title Method For Producing An Electronic Module Assembly And Electronic Module Assembly
Inventorship Reinhold Bayerer, Reichelsheim (DE)
Assignee Infineon Technologies AG, Neubiberg (DE)

Claim of US Patent No. 10,462,921

1. A method for producing an electronic module assembly, the method comprising:curing a curable first mass extending between a substrate assembly and a module housing while a circuit carrier of the substrate assembly has a temperature of at least a first temperature;
forming an adhesive connection between a side wall of the module housing and the substrate assembly by curing a curable second mass; and
cooling down the circuit carrier subsequent to curing the first mass to below a second temperature lower than the first temperature,
wherein the electronic module is produced such that the circuit carrier comprises a heat exchange surface facing away from the cured first mass, wherein a point of the heat exchange surface opposite the cured first mass comprises, when the electronic module assembly is heated to at least the first temperature, a first distance from a lid of the module housing, wherein the point of the heat exchange surface comprises, when the electronic module assembly is cooled to less than or equal to the second temperature, a second distance from the lid of the module housing, and wherein a difference between the first distance and the second distance is at least 10 ?m.