US Patent No. 10,462,911


Patent No. 10,462,911
Issue Date October 29, 2019
Title High-current Transmitting Method Utilizing Printed Circuit Board
Inventorship Chang Hui Lee, Cheonan-Si (KR)
Dong Hyun Kim, Sejong-Si (KR)
Assignee LG CHEM, LTD., Seoul (KR)

Claim of US Patent No. 10,462,911

1. A multilayer printed circuit board each layer of which is printed with a circuit pattern, the multilayer printed circuit board comprising via holes for connecting circuits of each layer, wherein each via hole is a through hole having a pair of open ends, and wherein each via hole comprises:a plating layer formed on a side wall of the via hole, the plating layer including a Cu plating layer plated with Cu on the side wall of the via hole and an Au plating layer formed on the Cu plating layer; and
a solder cream on the Au plating layer and filled in a vacant surface of the via holes on which the plating layer is formed.