US Patent No. 10,462,909

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD MANUFACTURING DEVICE


Patent No. 10,462,909
Issue Date October 29, 2019
Title Wiring Board Manufacturing Method And Wiring Board Manufacturing Device
Inventorship Kenji Tsukada, Toyota (JP)
Masatoshi Fujita, Anjo (JP)
Yoshitaka Hashimoto, Kariya (JP)
Akihiro Kawajiri, Chiryu (JP)
Masato Suzuki, Chiryu (JP)
Assignee FUJI CORPORATION, Chiryu-shi (JP)

Claim of US Patent No. 10,462,909

1. A wiring board manufacturing method comprising:a resin layer forming step of forming a resin layer by applying a UV-curable resin ink and applying UV light to the applied resin ink;
a wiring layer forming step of forming a wiring layer by applying a conductive ink on the resin layer and applying a laser light or a pulse light including a continuous spectrum to the applied conductive ink;
wherein
the wiring board is manufactured by layer building the resin layer and forming the wiring layer by performing the resin layer forming step and the wiring layer forming step in a predetermined order, and
in a case in which the wiring layer forming step is performed directly after performing the resin layer forming step, during the prior resin layer forming step, the UV light is applied such that an integral light amount is a first integral light amount, and
in a case in which another resin layer forming step is performed consecutively directly after performing the resin layer forming step, during at least a portion of the prior resin layer forming step, the UV light is applied such that the integral light amount is a second integral light amount that is smaller than the first integral light amount.