US Patent No. 10,462,908

CONDUCTIVE PATTERNS AND METHODS OF USING THEM


Patent No. 10,462,908
Issue Date October 29, 2019
Title Conductive Patterns And Methods Of Using Them
Inventorship Oscar Khaselev, Monmouth Junction, NJ (US)
Nitin Desai, Princeton Junction, NJ (US)
Michael T. Marczi, Chester, NJ (US)
Bawa Singh, Voorhees, NJ (US)
Assignee Alpha Assembly Solutions Inc., Waterbury, CT (US)

Claim of US Patent No. 10,462,908

1. A device comprising at least one high-aspect ratio conductive pattern disposed thereon, wherein the device comprises a substrate and wherein the high aspect ratio conductive pattern is produced by:a. disposing a support layer on the substrate defining a spacing having an effective height;
b. disposing a conductive material between the defined spacing of the support layer, wherein the conductive material comprises metal particles, said metal particles comprising a metal or a metal salt capped with a capping agent, wherein the capping agent has a molecular weight of at least about 100 g/mol; and
c. removing the support;
wherein further support layers can be disposed followed by disposing of additional conductive material to increase the effective height of the high aspect ratio conductive pattern, prior to removing the support.