US Patent No. 10,462,904


Patent No. 10,462,904
Issue Date October 29, 2019
Title Electronic Component Mounting Package And Electronic Device
Inventorship Takayuki Shirasaki, Omihachiman (JP)
Assignee Kyocera Corporation, Kyoto (JP)

Claim of US Patent No. 10,462,904

1. An electronic component mounting package, comprising:a housing including
a body portion comprising an upper surface disposed with an concave portion, a lower surface disposed with a notched portion, and a through hole extending from a bottom surface of the concave portion to a bottom surface of the notched portion, and
a projecting ridge portion located on the bottom surface of the notched portion;
a terminal comprising an upper end projecting through the through hole into an interior of the concave portion and a lower end projecting into an interior of the notched portion; and
a flexible substrate extending from the interior of the notched portion to an exterior of the notched portion, the flexible substrate being joined to the terminal, the flexible substrate abutting on the projecting ridge portion to be bent.